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| K-Band Packaged Power Amplifier TGA4525-SM Key Features and Performance * * * * * * 17GHz - 27GHz Bandwidth 22 dB Typical Gain 37 dBm Typical OTOI 29 dBm Typical P1dB Vd = 7V, Id = 760mA (Id = 830mA @ P1dB) Package Dimensions: 5.0 x 5.0 x 1.10 mm Measured Performance Vd = 7V, Id = 760mA Primary Applications * * * Point-to-Point Radio K-Band Sat Com Point-to-Multipoint Communications Product Description The TriQuint TGA4525-SM is a packaged high power amplifier for K-Band applications. The part is designed using TriQuint's power pHEMT production process. The TGA4525-SM provides a nominal 29dBm output power at 1dB gain compression with a small signal gain of 22dB. The part is ideally suited for low cost emerging markets such as K-Band satellite communications, point-to-point & point-tomultipoint communications. Evaluation boards are available upon request. Lead-Free & RoHS compliant. Datasheet subject to change without notice 1 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Sep 2009 (c) Rev A TGA4525-SM TABLE I ABSOLUTE MAXIMUM RATINGS 1/ Symbol Vd Id Vg | Ig | PIN PD Parameter Drain Supply Voltage Drain Supply Current (Quiescent) Gate Voltage Range Gate Supply Current Input Continuous Wave Power Power Dissipation Mounting Temperature (10 seconds) Storage Temperature 1/ Value 8V 1100 mA -5 to 0 V 28 mA 26 dBm 8.8 W 200 C 260 C -65 to 150 C Notes Tchannel Channel Temperature 2/ These ratings represent the maximum operable values for this device. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device and / or affect device lifetime. These are stress ratings only, and functional operation of the device at these conditions is not implied. Combinations of supply voltage, supply current, input power, and output power shall not exceed PD. 2/ 2 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Sep 2009 (c) Rev A TGA4525-SM TABLE II RF CHARACTERIZATION TABLE (TA = 25C, Nominal) (Vd = 7V, Id = 760mA 5%) Symbol Parameter Test Conditions Typ Units Gain Small Signal Gain F = 17 - 27 GHz 22 dB IRL Input Return Loss F = 17 - 27 GHz -8 dB ORL Output Return Loss Output Power @ 1dB Gain Compression Saturated Power Output Third Order Intercept @ Pin = -10dBm Small Signal Gain Temperature Coefficient F = 17 - 27 GHz -10 dB P1dB F = 17 - 27 GHz 29 dBm Psat F = 17 - 27 GHz 31 dBm OTOI F = 17 - 27 GHz 37 dBm dB/0C F = 17 - 27 GHz 0.04 3 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Sep 2009 (c) Rev A TGA4525-SM TABLE III THERMAL INFORMATION Parameter JC Thermal Resistance (Channel to Backside of package) Test Conditions Vd = 7V Id = 760mA PD = 5.3W TBASE = 70 C Tchannel (C) 150 JC (C/W) 15.1 Tm (hrs) 1E+6 Note: Thermal transfer is conducted through the bottom of the TGA4525-SM package into the motherboard. The motherboard must be designed to assure adequate thermal transfer to the base plate. Median Lifetime (Tm) vs. Channel Temperature 4 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Sep 2009 (c) Rev A Measured Performance 26 24 22 20 18 Gain (dB) 16 14 12 10 8 6 4 2 0 15 16 17 18 19 20 21 22 23 24 25 26 27 Vd = 5 - 8V, Id = 760mA TGA4525-SM 5V 6V 7V 8V 28 29 30 Frequency (GHz) 0 Vd = 7V, Id = 760mA -2 -4 -6 Return Loss (dB) -8 -10 -12 -14 -16 -18 -20 15 16 17 18 19 20 21 22 23 24 25 26 27 28 IRL ORL 29 30 Frequency (GHz) 5 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Sep 2009 (c) Rev A Measured Performance 33 Saturated Power @ Pin = 18dBm (dBm) 32 31 30 29 28 27 26 25 24 23 22 16 17 18 19 20 21 22 23 24 25 26 Vd = 5 - 8V, Id = 760mA TGA4525-SM 5V 6V 7V 8V 27 28 Frequency (GHz) 33 32 31 Output Power (dBm) 30 29 28 27 26 25 24 23 22 16 17 18 19 20 21 22 23 Frequency (GHz) 24 25 26 27 28 Vd = 7V, Id = 760mA P1dB Psat 6 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Sep 2009 (c) Rev A Measured Performance Vd = 7V, Id = 760mA TGA4525-SM 1000 34 32 30 28 Pout (dBm) & Gain (dB) 26 24 22 20 18 16 14 12 10 8 6 4 -10 -8 -6 -4 -2 0 2 4 6 8 10 12 14 16 18 20 Pin (dBm) 40 39 38 Average OTOI (dBm) 37 36 35 34 33 32 31 30 16 17 18 19 20 21 22 23 Frequency (GHz) 24 25 26 27 28 @ 20 GHz Pout 980 960 940 920 Gain Id 900 880 860 840 820 800 780 760 740 720 700 Id (mA) 7 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Sep 2009 (c) Rev A Measured Performance Vd = 7V, Id = 760mA TGA4525-SM 41 40 39 38 OTOI (dBm) 37 36 35 34 33 32 31 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Output Power/Tone (dBm) 0 -5 -10 -15 -20 IMD3 (dBm) -25 -30 -35 -40 -45 -50 -55 -60 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 8 17GHz 19GHz 23GHz 25GHz 17GHz 19GHz 23GHz 25GHz Output Power/Tone (dBm) TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Sep 2009 (c) Rev A Package Pinout TGA4525-SM Bottom View Description RF Input RF Output Vd Vg Ground N/C 4 21 14, 26 10, 30 1, 8, 9, 16, 17, 24, 25, 32, 33* 2, 3, 5, 6, 7, 11, 12, 13, 15, 18, 19, 20, 22, 23, 27, 28, 29, 31 Pin Number * Center pad is used for Ground as well as heat dissipation of the part. 9 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Sep 2009 (c) Rev A Mechanical Drawing TGA4525-SM Bottom View Units: mm Tolerances: 0.076 unless specified 10 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Sep 2009 (c) Rev A TGA4525-SM Characterization Board Vg (One Side Optional) Vd 1uF 100pF 1uF 100pF RF In RF Out 100pF 1uF 100pF 1uF (One Side Optional) Vg Vd 0.010" 0.086" 0.032" 11 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Sep 2009 (c) Rev A Application Circuit TGA4525-SM Vg (One Side Optional) 1F 100pF 100pF Vd 1F Vg RF In Vd RF Out TGA4525-SM Vg Vd Vg (One Side Optional) 1F Vd 100pF 1F 100pF Vd = 5 to 7V Vg = -0.55V Typical to get Id = 760mA 12 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Sep 2009 (c) Rev A TGA4525-SM Recommended Surface Mount Package Assembly Proper ESD precautions must be followed while handling packages. TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven vendors' recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed in the table below. Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement. The volume of solder paste depends on PCB and component layout and should be well controlled to ensure consistent mechanical and electrical performance. Compatible with high volume surface mount assembly processes using no-clean flux Typical Solder Reflow Profiles Reflow Profile Ramp-up Rate Activation Time and Temperature Time above Melting Point Max Peak Temperature Time within 5 C of Peak Temperature Ramp-down Rate SnPb 3 C/sec 60 - 120 sec @ 140 - 160 C 60 - 150 sec 240 C 10 - 20 sec 4 - 6 C/sec Pb Free 3 C/sec 60 - 180 sec @ 150 - 200 C 60 - 150 sec 260 C 10 - 20 sec 4 - 6 C/sec Ordering Information Part TGA4525-SM Package Style QFN 5x5 Surface Mount 13 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Sep 2009 (c) Rev A |
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